Outlook
A new approach ? a compact model for technology developers; a circuit model with process-variable inputs
- Minimum measurement data ? integration into automatic wafer test
- One-iteration extraction ? principal philosophy
- Dynamic development ? extension to “any” new set of technology data
Applications
- Experimental correlation ? efficiently reduce wafer split-lot
- New technology development ? provide a quick and reliable prediction
- Statistical analysis ? process control and monitoring
Vision ? combined with a “calibrated” full-loop TCAD tool, the multi-level compact modeling approach can be extremely helpful in providing solutions and services to bridge the circuit designers with the technology developers
Potential impact ? a bit early to claim real significance, but it won’t be too difficult to deduce from the way SPICE has shaped the EDA industry