Applications and Future Development
A new approach ? a compact model for technology developers; a circuit model with process-variable input
- Minimum measurement data ? integration into automatic wafer test system
- One-iteration extraction ? principal philosophy
- Dynamic development ? extension to “any” new set of technology data
Applications
- Empirical correlation ? efficiently reduce wafer split-lot
- Statistical analysis ? process control and monitoring
- New technology development ? provide a quick and reliable prediction
Future development
- AC/RF compact modeling ? following the same approach and philosophy
- Circuit-level simulation ? implementation in the multi-level simulator, Xsim
Vision ? the multi-level compact modeling approach can be extremely helpful in providing solutions and services to bridge the circuit designers with the technology developers